Texas Instruments Breaks Ground on New 300-MM Semiconductor Wafer Fabrication Plants in Sherman, Texas

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“Today is an important milestone as we lay the groundwork for the future growth of semiconductors in electronics to support our customers’ demand for decades to come,” Templeton said. “Since our founding more than 90 years ago, we’ve operated with a passion to create a better world by making electronics more affordable through semiconductors. TI is excited to bring advanced 300-mm semiconductor manufacturing to Sherman.”

The potential $30 billion investment includes plans for four fabs to meet demand over time, supporting as many as 3,000 direct jobs. The new fabs will manufacture tens of millions of analog and embedded processing chips daily that will go into electronics everywhere.

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Texas Instruments Chairman, President and CEO Rich Templeton (center); Texas Governor Greg Abbott; and Sherman Mayor David Plyler, along with company leaders, participate in a groundbreaking ceremony for TI’s new 300-mm semiconductor wafer fabs in Sherman, Texas. Photo Source: Texas Instruments.

“This groundbreaking marks the next era of semiconductor production in Sherman that promises to create decades of economic opportunity and improve the quality of life for the region,” said David Plyler, mayor of Sherman. “We are grateful for TI’s long and continued investment in Sherman and look forward to our continued partnership.”

Sustainable manufacturing

TI has a long-standing commitment to responsible, sustainable manufacturing. The new fabs will be designed to meet one of the Leadership in Energy and Environmental Design (LEED) building rating system’s highest levels of structural efficiency and sustainability: LEED Gold. Advanced 300-mm equipment and processes in Sherman will further reduce waste, water, and energy consumption.

Investing in internal 300-mm manufacturing

Production from the first Sherman fab is expected in 2025. The fabs will complement TI’s existing 300-mm fabs, which include DMOS6 (Dallas), RFAB1, and the soon-to-be-completed RFAB2 (both in Richardson, Texas), which is expected to start production later this year. Additionally, LFAB (Lehi, Utah) is expected to begin production in early 2023. “These investments in long-term manufacturing capacity further extend the company’s cost advantage and provide greater control of our supply chain,” Templeton said.

Learn more about TI in Sherman at TI.com/Sherman.

Source: Texas Instruments

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