Texas Instruments (TI) introduced a new power-management chip that was designed to support the growing energy demands of modern data centers.
The company’s latest creation, TPS1885, is the industry’s first 48V integrated hot-swap eFuse with power-path protection. This helps data centers manage high-power processing needs efficiently.
TI also launched a new family of integrated gallium nitride (GaN) power stages– the LMG3650R035, LMG3650R025and LMG3650R070– which provide enhanced efficiency in industry-standard transistor outline leadless (TOLL) packaging. The advancements are being shared at the 2025 Applied Power Electronics Conference (APEC) in Atlanta, Georgia, from March 16-20, 2025.
“With data centers increasingly demanding more energy, powering the world’s digital infrastructure begins with smarter, more efficient semiconductors,” said Robert Taylor, general manager, Industrial Power Design Services. “While advanced chips drive AI’s computational power, analog semiconductors are key to maximizing energy efficiency. Our latest power-management innovations are enabling data centers to reduce their environmental footprint while supporting the growing needs of our digital world.”
With data centers shifting to 48V power architectures, the TPS1685 eFuse enables power levels beyond 6kW, offering a scalable solution that reduces design complexity and cuts solution size in half, compared to traditional hot-swap controllers.
TI’s new power solutions will be on display at booth number 1213 at APEC.
Source: Texas Instruments (TI)
